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Extruded Heatsink
SRX28-028-P7
01
The SRX28-028-P7 profile heat sink adopts a one-piece extruded structure, with a uniform and delicate matte surface—a typical feature after anodizing treatment. Dense and orderly fins are arranged longitudinally along the base material; their uniform thickness and regular spacing not only maximize the heat dissipation surface area but also optimize the air convection path. The flat and smooth bottom of the base material is pre-equipped with precise mounting holes, adapting to the assembly needs of various electronic components. The overall design balances practicality and structural stability, demonstrating exquisite manufacturing craftsmanship. As a professional profile heat sink manufacturer, the product we developed is a high-performance High Thermal Conductivity Extruded Heat Sink integrating efficient heat dissipation and durability, with core advantages derived from strict control over materials and processes.
01
We select high-purity 6063 aluminum alloy as the base material, which has a thermal conductivity of up to 200W/(m·K). Combined with precision extrusion technology, the heat sink is formed in one piece without splicing gaps, significantly reducing thermal resistance and ensuring rapid heat conduction from the heat source to the entire fin area. The product surface adopts a high-standard anodizing process to create a high-qualityAnodized Heat Sink.
01
The thickness of the oxide film is controlled at 10-15μm. After sealing treatment, it not only endows the heat sink with excellent corrosion resistance and wear resistance, effectively resisting erosion in high-temperature and high-humidity environments and extending service life but also improves surface emissivity and enhances radiant heat transfer efficiency, achieving the dual benefits of "protection and heat dissipation". This process balances the insulating properties of the oxide film and the thermal conductivity of the base material, avoiding equipment operation issues caused by local overheating.
01
Targeting the heat dissipation needs of consumer electronic devices such as optical modems and routers, the SRX28-028-P7 optimizes the fin structure design precisely. The height and spacing of the fins are adjusted through fluid dynamics simulation, perfectly adapting to the narrow internal space and air duct layout of such devices, maximizing heat dissipation efficiency within a limited volume. It can accurately match high power-density components such as PON chips in optical modems and core processing chips in routers. The product boasts significant lightweight advantages, weighing only 1/3 of copper heat sinks of the same specification, without increasing the overall volume and weight of the equipment.
01
It is suitable for various installation forms of optical modems and routers in home and office scenarios, such as desktop placement and wall-mounted installation. Its efficient heat dissipation capacity ensures that the temperature of core components remains within a safe range during 24/7 continuous operation of the equipment, avoiding network lag and unstable signals caused by overheating, which meets the dual demands of consumer electronics for reliability and practicality.